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The public exchange between ASML and TSMC is about far more than the cost of High NA lithography. It signals a broader shift in semiconductor strategy, where competitive advantage increasingly depends on architecture, industrial coordination and the orchestration of technological ecosystems.
Behind many of the technologies shaping the future of computing stands a different type of institution. This briefing explores how imec has become one of Europe’s most important research infrastructures for semiconductors, photonics, AI hardware and advanced packaging technologies.
As AI systems become larger and more complex, advanced packaging is emerging as one of the semiconductor industry’s most critical bottlenecks — transforming the back-end of chip manufacturing into strategic infrastructure.
As AI infrastructure transforms the semiconductor industry, Italy is emerging as one of Europe’s most important hubs for advanced packaging, systems integration and the physical architecture connecting future computing systems.
As Europe rethinks the original ambitions of the Chips Act, a new semiconductor strategy is emerging — one focused less on scale and more on control over the critical technological layers underpinning modern infrastructure.
As Europe rethinks the ambitions of its original Chips Act, a new semiconductor strategy is emerging—one focused less on manufacturing scale and more on securing critical technological layers, from advanced packaging and photonics to Industrial AI, infrastructure and technological indispensability.
As Chips Act 2.0 begins to reshape Europe’s semiconductor ambitions, a new doctrine is quietly emerging — one focused less on full autonomy and more on becoming structurally indispensable inside the global technology ecosystem.
AI chips are hitting physical limits, forcing the semiconductor industry to rethink how processors are built. As architectures shift from single chips to stacked “silicon skyscrapers” advanced packaging is emerging as the next critical frontier in the race for AI computing power.
Artificial intelligence is often framed as a race for larger data centres and greater energy supply. Professor Martijn Heck argues that the real frontier lies elsewhere: in the architecture of the chip itself. By integrating electronics, photonics and advanced packaging into unified systems, heterogeneous integration may determine whether AI scales sustainably — or overwhelms the infrastructure it depends on. In this conversation, Heck outlines why better chips, not bigger factories, will shape the technological balance of the coming decades.
