As Chips Act 2.0 begins to reshape Europe’s semiconductor ambitions, a new doctrine is quietly emerging — one focused less on full autonomy and more on becoming structurally indispensable inside the global technology ecosystem.
CHIPS ACT 2.0 — The New European Semiconductor Architecture
How Europe is rethinking sovereignty, infrastructure and technological power in the age of AI and semiconductor fragmentation
As Europe continues shaping the next phase of its semiconductor strategy, a deeper strategic shift is becoming increasingly visible — away from manufacturing scale alone and toward control over the critical technological layers underpinning modern infrastructure.
Europe’s first Chips Act largely focused on manufacturing capacity and attracting major semiconductor investments. But across Europe, a broader discussion is now emerging: technological sovereignty is not only about production volume — it is also about securing the strategic layers of the ecosystem itself.
This series examines how the debate surrounding Chips Act 2.0 reflects a wider industrial and geopolitical reorientation. From advanced packaging and photonics to Industrial AI, chiplets, research ecosystems and infrastructure coordination, Europe is increasingly exploring where it can become structurally indispensable within the global technology landscape.
Across four Perspective essays, Altair Media Europe explores how semiconductors are evolving from an industrial sector into a foundational infrastructure layer of modern society — and what that transformation may mean for Europe’s future position in the world.
As Europe rethinks the original ambitions of the Chips Act, a new semiconductor strategy is emerging — one focused less on scale and more on control over the critical technological layers underpinning modern infrastructure.
As AI infrastructure transforms the semiconductor industry, Italy is emerging as one of Europe’s most important hubs for advanced packaging, systems integration and the physical architecture connecting future computing systems.
As AI systems become larger and more complex, advanced packaging is emerging as one of the semiconductor industry’s most critical bottlenecks — transforming the back-end of chip manufacturing into strategic infrastructure.
