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As AI systems become larger and more complex, advanced packaging is emerging as one of the semiconductor industry’s most critical bottlenecks — transforming the back-end of chip manufacturing into strategic infrastructure.
As AI infrastructure transforms the semiconductor industry, Italy is emerging as one of Europe’s most important hubs for advanced packaging, systems integration and the physical architecture connecting future computing systems.
As Europe rethinks the original ambitions of the Chips Act, a new semiconductor strategy is emerging — one focused less on scale and more on control over the critical technological layers underpinning modern infrastructure.
As Europe rethinks the ambitions of its original Chips Act, a new semiconductor strategy is emerging—one focused less on manufacturing scale and more on securing critical technological layers, from advanced packaging and photonics to Industrial AI, infrastructure and technological indispensability.
