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As Chips Act 2.0 begins to reshape Europe’s semiconductor ambitions, a new doctrine is quietly emerging — one focused less on full autonomy and more on becoming structurally indispensable inside the global technology ecosystem.
As AI systems become larger and more complex, advanced packaging is emerging as one of the semiconductor industry’s most critical bottlenecks — transforming the back-end of chip manufacturing into strategic infrastructure.
As AI infrastructure transforms the semiconductor industry, Italy is emerging as one of Europe’s most important hubs for advanced packaging, systems integration and the physical architecture connecting future computing systems.
As Europe rethinks the original ambitions of the Chips Act, a new semiconductor strategy is emerging — one focused less on scale and more on control over the critical technological layers underpinning modern infrastructure.
